LED Packaging

In the actual development of the product, at the present stage light electronic on lighting package already by general middle and lower power components to COB form gradually, the existing series of 3 ~ 25 w COB can not only lock on the heat dissipation module directly, and then save the SMT process, also by big light emitting area, low resistance and low current density features such as to provide more space for heat dissipation, easier to assemble on the lamps and lanterns, create a lower cost structure. According to introducing, LM80 light electronic COB series have passed the test, to show the performance of the durability and high efficiency, the future in the product planning, light electronics will focus on further emphasizes the energy-efficient, high pressure, high in color direction with high cost performance, etc.

Crystal tyco electronics with no gold thread based on the technology of flip chip technology platform as the core research and development direction, this year the company launched a power “chip level LED lighting as a whole solution”, namely in the LED chip made process, through the new process of chip level to complete part of the traditional craft or save the traditional packaging process, the LED eventually to encapsulate volume smaller, more stable performance. The series of “easy” and flip chip ceramic base COB products (FCOB) using APT inversion welding patent technology, has realized the single chip and multichip module without gold line, solid crystal gel encapsulation, high brightness, high photosynthetic efficiency, high reliability, low thermal resistance, good color uniformity. At present, jing ke electronic spending on high power and the power capacity is more, high power capacity of about 10 kk/month; The power capacity is about 80 kk/month, at the end of the year goal is to expand to 100 kk/month, mainly supply large size TV backlight and LED lighting market.