Encapsulation materials stress processing performance and high pervious to light
In general, about the latest development of the LED packaging technology for encapsulation materials generally put forward the requirements of the following three aspects: good processability, ensure higher production efficiency; Assist in LED products is helpful; I have to be very stable and reliable. In traditional LED packaging material with a plastic support, for example, DSM (DSM) engineering plastics business application development and technical support manager of lighting industry asia-pacific Wu Rui said, more and more customers at the start of a material reflectivity and maintain performance is put forward on the increasingly stringent requirements, and in the view of improving the performance of these at the same time, also have to reduce the cost. “For the cost of injection products, in addition to the material itself, the production cost is also very important, as more than cavity injection has gradually become the mainstream of the current processing plant one option, this is the flow of processing performance material properties and processing properties put forward higher requirements.”
Aimed at the application of DSM has long been committed to the development of high thermal conductivity polymer used in radiator and LED bulb shell, high reflection yellowing resistant materials applied optics components, and SMT high temperature resistant and yellowing resistance material used in the LED module connector, etc. For example of the development of the company based on the latest PA4T base material, with high temperature resistance (meet the SMT process), high reflection, high mechanical strength of engineering plastics (Stanyl For Tii LX), compared with other types of materials, it has high initial reflectivity, and the reflectivity of keep better performance after reflow soldering, help to improve the luminous efficiency of LED light source; Have the better performance of injection molding processing, can meet the production of higher efficiency and smaller product design requirements; Good ability to resist UV, With less water, silicone or epoxy resin sealant has excellent adhesive force, guaranteeing the long life of the LED chip, etc.