“LED encapsulation will toward high luminous efficiency, high reliability, high heat capacity and light-weight change direction,” said the exemption, “the development of chip technology, more and more high luminous efficiency, encapsulation products new packaging technology, packaging technology will be widely used, such as eutectic technology, flip chip technology, a new fluorescent powder coating process in improving products such as high reliability, high heat dissipation at the same time, also will further improve the luminous efficiency, high temperature resistance, resistance to ultraviolet, and low water absorption, such as tolerance, thermosetting EMC better material, thermoplastic PCT, amend PPA and ceramic material such as plastic will be a lot of use; the light of the market will pay more attention to packaging product quality and low cost, and the quality standards of LED products will be increasingly perfect and unified.”
And, more importantly, with the LED packaging technology and manufacturing process of innovation, to promote encapsulation link position in the whole industry chain development in the direction of vertical. Chen Haiying said about it, all technical progress to meet the practical application of market demand, eventually in the market for every dollar lumens (lm / $) photosynthetic efficiency, under the pressure of rising demand ChanLi device packaging smaller body, in order to achieve the minimum cost to be able to have the highest luminous flux output.
This needs to be LED packaging technology from the IC package can be more mature experience, such as EMC, SMC materials, in the process, industry division of labor will constantly adjust due to advances in technology, simple encapsulated within the industry will be more and more difficult to link as an independent industry, the development of new technology will promote industry on vertical integration.