Along with the advance of solid-state lighting technology, COB (chip on board) packaging technology gets more and more attention, because of the COB light source has a low thermal resistance, high luminous flux density, less glare, light-emitting character such as uniform, has been widely used in indoor and outdoor lighting, such as downlight, ball bubble lamp, daylight lamp, street lamp, and industrial and mining lamp.
COB encapsulation are presented in this paper elaborates the advantages compared with the traditional LED encapsulation, mainly from the production efficiency advantages, the advantages of low thermal resistance, light quality, advantage, application advantages, cost advantages, comparing the five aspects that COB encapsulation leading position in the development of LED lighting field in the future.
1. The production efficiency advantages
OB packages on the production process and traditional SMD production processes are basically the same, in the solid crystal, welding line process and SMD encapsulation efficiency fairly basic, but in dispensing, separation, spectral, packaging, COB encapsulation efficiency, much higher than the SMD products, SMD packaging manual and manufacturing costs about 15% of the cost of material, COB encapsulation labor and manufacturing costs about 10% of the cost of materials, USES the COB encapsulation, artificial and the manufacturing cost can save 5%.
2. The advantages of low thermal resistance
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Traditional SMD encapsulation system thermal resistance for application: chips – solid glue, solder, solder paste – copper foil – insulating layer – aluminum. COB encapsulation system thermal resistance for: chips – solid glue – aluminum. COB encapsulation system thermal resistance is much lower than traditional SMD encapsulation system thermal resistance, increase the life span of the LED.