LED packaging size of the market in Chinese mainland in 2012 get to 39.7 billion yuan, up 24% than a year earlier.
Among them, LED high-power devices market size of 10.47 billion yuan, up 41.4%; LED the power device in the market size of 4.34 billion yuan, up 37.7%; LED low power devices market size of 24.9 billion yuan, up 15.8% from a year earlier.
GLII is expected, the downstream application market demand gradually release positive stimulus, in the next few years in mainland China LED encapsulation market size will remain more than 16% of the growth.
Among them, the high power device in the market demand will continue strong trend, keep more than 30% of high growth, become the packaging market in the next few years the rapid growth of main engine.
LED low power devices market demand growth will continue in 2012 growth momentum.
As the lighting market demand explosive growth, high-power packaging market will appear in the blowout needs, market demand and product continuous high gross profit margins become crazy most of the LED packaging companies enter into the field of high-power encapsulated in the main reason.
In high power devices into lighting light source
Before 2009 L ED lighting light source, mainly used for the product low power devices and high power 1 w lumens is given priority to, but in 2010, with the power in the 2835, 5630, 3030, 5630, 3030 series IC is gradually applied in the field of lighting lamps and lanterns and encapsulation, COB encapsulation device, with the rapid development of LED lighting lamps and lanterns of the main light source has been replaced with the medium and high power. The main reason for the alternative products such as follows: