And the supply of products have the manufacturer said, LED encapsulation prices after the last two years of rapid drop, in addition to the lighting market price quickly, for a period of time in future packaging product reduction will be slow, the market basically remained stable. A subject is in front of all packaging companies, how to meet the needs of high efficiency, high cost performance? It requires that the LED encapsulation smaller, better quality of light, be helpful for heat dissipation, and higher wattage LED must be able to operate a single star. Under this trend, optimize encapsulation technology and manufacturing process, improve the luminous efficiency, and reduce the cost of production of LED encapsulation, undoubtedly become the nowadays is the main direction of the development of industry.
COB encapsulation formally entered the practical stage
For backlight, lighting the two LED market driven engine, on the demand for LED encapsulation exists both in common, photosynthetic efficiency, as well as the best cost-effective products; At the same time also have different requirements. Jing ke electronic (guangzhou) co., LTD., director of application development Chen Haiying, backlight market demand for LED encapsulation, also at the request of the luminous intensity of single star device is higher and higher, resulting in a single package components of the input power is more and more big, the luminous flux emitted by also more and more big, this is a backlight from whole scheme above requirements of cost reduction. Therefore, the LED devices need to increase materials heat resistance, meet the reliability assurance of high power input, and improve the ability of chip large current shock resistance, meet monomer specular pass under the output performance of the price terms.