Phenyl the advantages of organic silicon encapsulating materials is also has good thermal stability, make its can be widely used in 5 ~ 50 w LED chip on board encapsulation structure of many high power general lighting products. Compared with the technology of methyl phenyl silicone wrap material usually has a better gas barrier properties, and can prevent the silver electrode corrosion because of be affected with damp be affected with damp, and black. As a result of these electrode also has a dual role as LED reflective elements, thus improve the gas barrier performance can better maintain the LED light output performance and reliability.
A new manufacturing technology to promote industrial vertical integration
As the middle part of the industrial chain, LED encapsulation is in a critical period of technical updates, from a technical point of view, if continue to use traditional structure/process, will demand a higher cost performance of selected materials, thus it can be foreseen, including materials, manufacturing process, or both of the new packaging technology will also appear on the market. Have, for example, Taiwan manufacturers recently launched without the encapsulation of LED products, we have learned, is to chip technology, encapsulation, and light engine manufacturing developed by the combination of new technology, in addition to the general flip chip cooling sex good, more has the advantage of low cost. But there are also companies said, at present the technology is still in the evaluation stage, the main difficulty is that the fluorescent material coating is still unable to effectively control, so the quality is difficult to ensure the stability of photosynthetic efficiency and light, from a large number of production and use is needed for a period of time.